LFB-1102Super
產品說明
Flip Chip Bonder for TCB process
- It is the Chip to Substrate flip chip bonder for TCB process
- High throughput achieved by 2 Head Modular structure
- Capable of high-speed, high-accuracy flip chip bonding by adopting probe camera technology and linear motor that applies Shinkawa NRS technology
- Both high precision force control and position control as well as high-force bonding achieved at bond head’s Z-axis by high/low force switching function
- Cycle time reduced by short heating and cooling with high speed pulse heater
- Capable of various plunge-up methods as well as thin die pickup and handling
- Molten solder detection function and high-precision Z control reduce damage on devices (under low force mode)
- Stable NCP pre-dispense application achieved by dispense amount feedback function
- Process monitoring and management function securing stable quality and process portability
Specification
| ITEM | DETAILS | |
| Product Name | Flip Chip Bonder | |
| Model | LFB-1102Super | |
| Bonding Method | Pulse heat thermocompression | |
| Bonding Accuracy | ±2μm (3σ) by Shinkawa’s standard condition | |
| Machine Cycle Time | 1.6s/chip (excludes process time) by Shinkawa’s standard condition | |
| Bonding Force | 1 - 300N ※Capable of selecting bond force control method at bonding process
|
|
| Bonding Tool Setting Temperature | RT.- 400℃ (in 1℃ increments pulse heat) | |
| Bonding Stage Setting Temperature | RT.-120℃ | |
| Chip Size | □2 - 20mm t = 0.05 - 0.7mm | |
| Wafer Size | Max.φ300mm | |
| Workpiece Size | Width | 40 - 100mm (Maximum bonding area = 90mm) |
| Length | 120 - 250mm (Maximum bonding area = 240mm) | |
| Thickness | 0.1 - 2.5mm | |
| Option Available | Communication Interface SECS / GEM | |
| Utilities | Electricity | Single Phase AC200V±5％ 50/60 Hz 30 A and higher 2spots required (if other voltage, consult us) |
| Power Consumption | 5.0kW Maximum | |
| CDA | 500kPa (5kgf / cm2) 250L/min Connection：φ10 Tube 2spots | |
| Vacuum | Below -75kPa (gage) Connection：φ10 Tube 4spots | |
| Physical Dimensions and Mass | Approx. 3,644W × 2,191D × 1,932H mm Approx. 4,080kg (excludes monitor display and signal tower) |
|
※ Specifications are subject to change without prior notice.
