YSB55w
產品說明
High-Speed & High-Accuracy Flip Chip Bonder
- High-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process
- Outstanding positioning accuracy with a high-rigidity frame and control algorithms
- Bump recognition camera for high-performance positioning alignment
- Compact force control heads
- Compatibility with a wide range of flip-chip sizes from 2mm square to 30mm square
- Easy-to-configure Dipping station
Specification
| ITEM | DETAILS | |
| Product Name | Flip Chip Bonder | |
| Model | YSB55w | |
| Applicable PCB | L260 × W200 - L50 × W50mm | |
| PBC Thickness | 0.2 - 3.0mm | |
| PBC Transport Direction | Left to right (Option: right to left) | |
| Bonding Capability | 13,000 UPH (under optimal conditions, includes processing time) | |
| Bonding Accuracy | ±5μm (3σ) | |
| Component Supply Configuration | 12 inch wafers | |
| Applicable Components | □2 to 30 mm | |
| Power Supply | 3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz | |
| Air Supply Source | 0.5MPa or more, in clean, dry state | |
| External Dimensions | L2,090 × D1,866 × H1,550mm (YSB55w main unit & wafer feed unit) | |
| Weight | Approx. 3,500kg (YSB55w main unit & wafer feeder unit) | |
※ Specifications subject to change without prior notice.
