UTC-5100
產品說明
High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
- Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2mm) with completely updated X, Y and Z motors
- Capable of high quality bonding on diversified devices by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
- Equipped with electric flame-off unit capable of handling wire sizes φ18-50μm without changing unit
- Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm
- Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
- Facilitating the optimization of bonding parameters by automatic free air ball size setting
- Simultaneous detection and bonding capability in X and Y directions
- Capable of setting lighting color (red/blue) effective in improving detection rate
- Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology
- Capable of handling large-size magazines by use of magazine stacker system
- Facilitating the maintenance work by reviewing Z calibration method
- Capable of Cu wire and Ag wire bonding (option)
- Capable of handling multiple indexing processes (open feeder/tunnel feeder, etc.)
Specification
| ITEM | DETAILS | |
| Product Name | Wire Bonder | |
| Model | UTC-5100 | |
| Bonding Accuracy | ±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature) | |
| Bonding Speed | 42 ms/0.7 mm wire (45 ms/2 mm wire) (with loop control and force detection mode) Using Shinkawa standard device |
|
| Bonding Wire Length | 4 mm maximum (Varies depending on device conditions) | |
| Resolution | XY table: 0.1 μm, Z-axis: 0.1 μm | |
| Vibration Control | Shinkawa NRS - Non Reaction Servo System | |
| Bonding Area | X: 66mm - Camera offset, Y: 95mm - Camera offset | |
| Wire Size | φ18–50 μm | |
| Bonding Force | 3–1,000 gf | |
| No. of Bonding Wires | 12,000 wires maximum | |
| Loader/Unloader | Fully automatic magazine stacker system (Option: stocker system) | |
| Workpiece Size | Width | 20–102 mm |
| Length | 95–300 mm | |
| Thickness | 0.1 - 0.5 mm (Varies depending on type of device) (Conversion parts are required when thickness changes) |
|
| Production Management | Management of equipment availability through production management monitoring screen | |
| Options Available | Communication interface SECS-I/SECS-II, HSMS, GEM | |
| Utilities | Input Power Supply | Single Phase 100VAC (±5% input variation) 50/60Hz (other voltages require transformer) |
| Power Consumption | Approx.1.2kVA (1.1kW) | |
| CDA | 500kPa (5 kgf/cm2) 102L/min | |
| Vacuum | -74kPa (-550 mmHg) or below (gauge) | |
| Physical Dimensions and Mass | 1,222W × 964D × 2,087H mm Approx. 520kg | |
※ Specifications are subject to change without prior notice
