SPA-1000
產品說明
High-Accuracy Twin-Head Die Bonder
- High-accuracy bonding by unique 3D-NRS technology
- High-productivity and space-saving footprint by adopting twin-head
- High-speed thin die pick-up system with a speed of 400ms / t:20um(option)
*Depending on material conditions - Friction-free bonding head with simultaneous positional and force control for thin die stacked devices
- Cleanness control with HEPA-filter and stainless steel full cover
- Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras
- Capable of handling large substrates up to 120mm width x 300mm length
Specification
| ITEM | DETAILS | |
| Product Name | Die Bonder | |
| Model | SPA-1000 | |
| Bonding Method | DAF bonding | |
| Accuracy | XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors) | |
| Productivity | The productivity increased by 2.5 times compared with conventional model. (Theoretical value with Shinkawa's standard sample) |
|
| Chip Size | □0.8 – 25mm | |
| Wafer Size | Maximum 12-inch | |
| Substrate/Leadframe Size | Width | 40 – 120mm |
| Length | 180 – 300mm | |
| Thickness | 0.05 – 0.8mm | |
| Options Available | Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT) | |
| Utilities | Input Power Supply | Single Phase AC200V±5％ 50/60Hz (Other power supply options available on request) |
| Power Consumption | Maximum 3.2 kVA (3.2kW) | |
| Air | 500kPa (5kgf/cm２) 900 L/min | |
| Vacuum | Below -74kPa (-550mmHg) (gage) | |
| Physical Dimensions and Mass | Approx. 2,280W × 1,510D × 1,670H mm Approx. 2,300 kg (excludes monitor display and signal tower) |
|
※ Configuration and specifications of this machine are subject to partial modification without prior notice.
