FPB-1s NeoForce
產品說明
Package Bonder for Multiple Processes
- Chip to Substrate package bonder for TCB process
- Capable of handling face down process (face up process as option)
- Capable of handling several kinds of processes such as TCB (NCP/NCF/TC-CUF), C2 and C4, and FO-WLP
- High-accuracy bonding achieved by adopting the unique Non-vibration System (NVS) technology
- Capable of handling high force up to 350N with Force Free Gantry (FFG)
- High throughput achieved by short heating and cooling time with high-speed pulse heater
- Flexibility to handle various plunge-up systems, enabling thin die handling
- Automatic product-type changeover function with capability to bond up to 4 different product-type chips, enabling 2.5D and 3D stack packaging
Specification
| ITEM | DETAILS | |
| Product Name | Package Bonder | |
| Model | FPB-1s NeoForce | |
| Bond Process Handling Capability | TCB (NCP/NCF/TC-CUF), C2 and C4, FO-WLP | |
| Bonding Accuracy | ±2.5μｍ（3σ）based on Shinkawa standard bonding conditions | |
| Machine UPH | UPH6,000 (C4 mode/process time not included) based on Shinkawa standard bonding conditions | |
| Bonding Force | 0.3 – 350N ※The bonding process can select either low force control or high force control; no switchover during a single bond profile.
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| Bonding Tool Setting Temperature | RT – 400℃ (1℃/Step, Pulse heat) | |
| Bonding Stage Setting Temperature | RT – 110℃ (1℃/Step) | |
| Chip Size | 1 – 22mm t＝0.02 – 0.7ｍｍ | |
| Chip Wafer Size | φ200mm, φ300mm | |
| Substrate Size | L : 120 – 300 mm, W : 40 – 200 mm (Max 450mm option), t : 0.2 – 2.5 mm | |
| Bonding Direction | Face down/Face up (Option/Other conditions available on request) | |
| Options Available | Communication interface SECSⅡ, HSMS and GEM | |
| Utilities | Input Power Supply | Single Phase AC200V–240V±5％ 50/60 Hz (Other power supply options available on request) |
| Power Consumption | Maximum 14.0kW | |
| Air | 570kPa（5.7kgf/cm２）300L/min Connection: φ10 Tube × 3 spots | |
| Vacuum | Below -75kPa (-550ｍｍHg) (gage) Connection: φ10 Tube × 3 spots | |
| Physical Dimensions and Mass | Approx. 1,510W × 1,620D × 1,750H mm Approx. 2,500kg (excludes monitor display and signal tower) |
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※ Configuration and specifications of this machine are subject to partial modification without prior notice
